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PCB词汇中英文对照(转)

上一篇 / 下一篇  2016-04-24 05:34:16

PCB词汇中英文对照
发布时间:2010-4-21

一、综合词汇

1、印制电路:printed circuit
2、印制线路:printed wiring
3、印制板:printed board
4、印制板电路:printed circuit board (PCB)
5、印制线路板:printed wiring board(PWB)
6、印制元件:printed component
7、印制接点:printed contact
8、印制板装配:printed board assembly
9、板:board
10、单面印制板:single-sided printed board(SSB)
11、双面印制板:double-sided printed board(DSB)
12、多层印制板:mulitlayer printed board(MLB)
13、多层印制电路板:mulitlayer printed circuit board
14、多层印制线路板:mulitlayer prited wiring board
15、刚性印制板:rigid printed board
16、刚性单面印制板:rigid single-sided printed borad
17、刚性双面印制板:rigid double-sided printed borad
18、刚性多层印制板:rigid multilayer printed board
19、挠性多层印制板:flexible multilayer printed board
20、挠性印制板:flexible printed board
21、挠性单面印制板:flexible single-sided printed board
22、挠性双面印制板:flexible double-sided printed board
23、挠性印制电路:flexible printed circuit (FPC)
24、挠性印制线路:flexible printed wiring
25、刚性印制板:flex-rigid printed board, rigid-flex printed board
26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板:flush printed board
29、金属芯印制板:metal core printed board
30、金属基印制板:metal base printed board
31、多重布线印制板:mulit-wiring printed board
32、陶瓷印制板:ceramic substrate printed board
33、导电胶印制板:electroconductive paste printed board
34、模塑电路板:molded circuit board
35、模压印制板:stamped printed wiring board
36、顺序层压多层印制板:sequentially-laminated mulitlayer
37、散线印制板:discrete wiring board
38、微线印制板:micro wire board
39、积层印制板:buile-up printed board
40、积层多层印制板:build-up mulitlayer printed board (BUM)
41、积层挠印制板:build-up flexible printed board
42、表面层合电路板:surface laminar circuit (SLC)
43、埋入凸块连印制板:B2it printed board
44、多层膜基板:multi-layered film substrate(MFS)
45、层间全内导通多层印制板:ALIVH multilayer printed board
46、载芯片板:chip on board (COB)
47、埋电阻板:buried resistance board
48、母板:mother board
49、子板:daughter board
50、背板:backplane
51、裸板:bare board
52、键盘板夹心板:copper-invar-copper board
53、动态挠性板:dynamic flex board
54、静态挠性板:static flex board
55、可断拼板:break-away planel
56、电缆:cable
57、挠性扁平电缆:flexible flat cable (FFC)
58、薄膜开关:membrane switch
59、混合电路:hybrid circuit
60、厚膜:thick film
61、厚膜电路:thick film circuit
62、薄膜:thin film
63、薄膜混合电路:thin film hybrid circuit
64、互连:interconnection
65、导线:conductor trace line
66、齐平导线:flush conductor
67、传输线:transmission line
68、跨交:crossover
69、板边插头:edge-board contact
70、增强板:stiffener
71、基底:substrate
72、基板面:real estate
73、导线面:conductor side 
74、元件面:component side
75、焊接面:solder side
76、印制:printing
77、网格:grid
78、图形:pattern
79、导电图形:conductive pattern
80、非导电图形:non-conductive pattern
81、字符:legend
82、标志:mark


二、基材:

1、基材:base material
2、层压板:laminate
3、覆金属箔基材:metal-clad bade material
4、覆铜箔层压板:copper-clad laminate (CCL)
5、单面覆铜箔层压板:single-sided copper-clad laminate
6、双面覆铜箔层压板:double-sided copper-clad laminate
7、复合层压板:composite laminate
8、薄层压板:thin laminate
9、金属芯覆铜箔层压板:metal core copper-clad laminate
10、金属基覆铜层压板:metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
12、基体材料:basis material
13、预浸材料:prepreg
14、粘结片:bonding sheet
15、预浸粘结片:preimpregnated bonding sheer
16、环氧玻璃基板:epoxy glass substrate 
17、加成法用层压板:laminate for additive process
18、预制内层覆箔板:mass lamination panel
19、内层芯板:core material
20、催化板材:catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板:adhesive-coated catalyzed laminate
22、涂胶无催层压板:adhesive-coated uncatalyzed laminate
23、粘结层:bonding layer
24、粘结膜:film adhesive
25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film
26、无支撑胶粘剂膜:unsupported adhesive film
27、覆盖层:cover layer (cover lay)
28、增强板材:stiffener material
29、铜箔面:copper-clad surface
30、去铜箔面:foil removal surface
31、层压板面:unclad laminate surface
32、基膜面:base film surface
33、胶粘剂面:adhesive faec
34、原始光洁面:plate finish
35、粗面:matt finish 
36、纵向:length wise direction 
37、模向:cross wise direction 
38、剪切板:cut to size panel
39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 
42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
49、超薄型层压板:ultra thin laminate
50、陶瓷基覆铜箔板:ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates

三、基材的材料

1、 A阶树脂:A-stage resin
2、 B阶树脂:B-stage resin
3、 C阶树脂:C-stage resin
4、环氧树脂:epoxy resin
5、酚醛树脂:phenolic resin
6、聚酯树脂:polyester resin
7、聚酰亚胺树脂:polyimide resin
8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin
9、丙烯酸树脂:acrylic resin
10、三聚氰胺甲醛树脂:melamine formaldehyde resin
11、多官能环氧树脂:polyfunctional epoxy resin
12、溴化环氧树脂:brominated epoxy resin
13、环氧酚醛:epoxy novolac
14、氟树脂:fluroresin
15、硅树脂:silicone resin
16、硅烷:silane
17、聚合物:polymer
18、无定形聚合物:amorphous polymer
19、结晶现象:crystalline polamer
20、双晶现象:dimorphism
21、共聚物:copolymer
22、合成树脂:synthetic
23、热固性树脂:thermosetting resin
24、热塑性树脂:thermoplastic resin
25、感光性树脂:photosensitive resin
26、环氧当量:weight per epoxy equivalent (WPE)
27、环氧值:epoxy value
28、双氰胺:dicyandiamide
29、粘结剂:binder
30、胶粘剂:adesive
31、固化剂:curing agent
32、阻燃剂:flame retardant
33、遮光剂:opaquer
34、增塑剂:plasticizers
35、不饱和聚酯:unsatuiated polyester
36、聚酯薄膜:polyester
37、聚酰亚胺薄膜:polyimide film (PI)
38、聚四氟乙烯:polytetrafluoetylene (PTFE)
39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP)
40、增强材料:reinforcing material
41、玻璃纤维:glass fiber
42、 E玻璃纤维:E-glass fibre
43、 D玻璃纤维:D-glass fibre
44、 S玻璃纤维:S-glass fibre
45、玻璃布:glass fabric
46、非织布:non-woven fabric
47、玻璃纤维垫:glass mats
48、纱线:yarn
49、单丝:filament
50、绞股:strand
51、纬纱:weft yarn
52、经纱:warp yarn
53、但尼尔:denier
54、经向:warp-wise
55、纬向:weft-wise, filling-wise
56、织物经纬密度:thread count
57、织物组织:weave structure
58、平纹组织:plain structure
59、坏布:grey fabric
60、稀松织物:woven scrim
61、弓纬:bow of weave
62、断经:end missing
63、缺纬:mis-picks
64、纬斜:bias
65、折痕:crease
66、云织:waviness
67、鱼眼:fish eye
68、毛圈长:feather length
69、厚薄段:mark
70、裂缝:split
71、捻度:twist of yarn
72、浸润剂含量:size content
73、浸润剂残留量:size residue
74、处理剂含量:finish level
75、浸润剂:size
76、偶联剂:couplint agent
77、处理织物:finished fabric
78、聚酰胺纤维:polyarmide fiber
79、聚酯纤维非织布:non-woven polyester fabric
80、浸渍绝缘纵纸:impregnating insulation paper
81、聚芳酰胺纤维纸:aromatic polyamide paper
82、断裂长:breaking length
83、吸水高度:height of capillary rise
84、湿强度保留率:wet strength retention
85、白度:whitenness
86、陶瓷:ceramics
87、导电箔:conductive foil
88、铜箔:copper foil
89、电解铜箔:electrodeposited copper foil (ED copper foil)
90、压延铜箔:rolled copper foil
91、退火铜箔:annealed copper foil
92、压延退火铜箔:rolled annealed copper foil (RA copper foil)
93、薄铜箔:thin copper foil 
94、涂胶铜箔:adhesive coated foil
95、涂胶脂铜箔:resin coated copper foil (RCC)
96、复合金属箔:composite metallic material
97、载体箔:carrier foil
98、殷瓦:invar
99、箔(剖面)轮廓:foil profile
100、光面:shiny side
101、粗糙面:matte side
102、处理面:treated side
103、防锈处理:stain proofing
104、双面处理铜箔:double treated foil

四、设计

1、原理图:shematic diagram
2、逻辑图:logic diagram
3、印制线路布设:printed wire layout
4、布设总图:master drawing
5、可制造性设计:design-for-manufacturability
6、计算机辅助设计:computer-aided design.(CAD)
7、计算机辅助制造:computer-aided manufacturing.(CAM)
8、计算机集成制造:computer integrat manufacturing.(CIM)
9、计算机辅助工程:computer-aided engineering.(CAE)
10、计算机辅助测试:computer-aided test.(CAT)
11、电子设计自动化:electric design automation .(EDA)
12、工程设计自动化:engineering design automaton .(EDA2)
13、组装设计自动化:assembly aided architectural design. (AAAD)
14、计算机辅助制图:computer aided drawing
15、计算机控制显示:computer controlled display .(CCD)
16、布局:placement
17、布线:routing
18、布图设计:layout
19、重布:rerouting
20、模拟:simulation
21、逻辑模拟:logic simulation
22、电路模拟:circit simulation
23、时序模拟:timing simulation
24、模块化:modularization
25、布线完成率:layout effeciency
26、机器描述格式:machine descriptionm format .(MDF)
27、机器描述格式数据库:MDF databse
28、设计数据库:design database
29、设计原点:design origin
30、优化(设计):optimization (design)
31、供设计优化坐标轴:predominant axis
32、表格原点:table origin
33、镜像:mirroring
34、驱动文件:drive file
35、中间文件:intermediate file
36、制造文件:manufacturing documentation
37、队列支撑数据库:queue support database
38、元件安置:component positioning
39、图形显示:graphics dispaly
40、比例因子:scaling factor
41、扫描填充:scan filling
42、矩形填充:rectangle filling
43、填充域:region filling
44、实体设计:physical design
45、逻辑设计:logic design
46、逻辑电路:logic circuit
47、层次设计:hierarchical design
48、自顶向下设计:top-down design
49、自底向上设计:bottom-up design
50、线网:net
51、威尼斯人线上娱乐化:digitzing
52、设计规则检查:design rule checking
53、走(布)线器:router (CAD)
54、网络表:net List
55、计算机辅助电路分析:computer-aided circuit analysis
56、子线网:subnet
57、目标函数:objective function
58、设计后处理:post design processing (PDP)
59、交互式制图设计:interactive drawing design
60、费用矩阵:cost metrix
61、工程图:engineering drawing
62、方块框图:block diagram
63、迷宫:moze
64、元件密度:component density
65、巡回售货员问题:traveling salesman problem
66、自由度:degrees freedom
67、入度:out going degree
68、出度:incoming degree
69、曼哈顿距离:manhatton distance
70、欧几里德距离:euclidean distance
71、网络:network
72、阵列:array
73、段:segment
74、逻辑:logic
75、逻辑设计自动化:logic design automation 
76、分线:separated time
77、分层:separated layer
78、定顺序:definite sequence

五、形状与尺寸:

1、导线(通道):conduction (track)
2、导线(体)宽度:conductor width
3、导线距离:conductor spacing
4、导线层:conductor layer
5、导线宽度/间距:conductor line/space
6、第一导线层:conductor layer No.1
7、圆形盘:round pad
8、方形盘:square pad
9、菱形盘:diamond pad
10、长方形焊盘:oblong pad
11、子弹形盘:bullet pad
12、泪滴盘:teardrop pad
13、雪人盘:snowman pad
14、 V形盘:V-shaped pad
15、环形盘:annular pad
16、非圆形盘:non-circular pad
17、隔离盘:isolation pad
18、非功能连接盘:monfunctional pad
19、偏置连接盘:offset land
20、腹(背)裸盘:back-bard land
21、盘址:anchoring spaur
22、连接盘图形:land pattern
23、连接盘网格阵列:land grid array
24、孔环:annular ring
25、元件孔:component hole
26、安装孔:mounting hole
27、支撑孔:supported hole
28、非支撑孔:unsupported hole
29、导通孔:via
30、镀通孔:plated through hole (PTH)
31、余隙孔:access hole
32、盲孔:blind via (hole)
33、埋孔:buried via hole
34、埋/盲孔:buried /blind via
35、任意层内部导通孔:any layer inner via hole (ALIVH)
36、全部钻孔:all drilled hole
37、定位孔:toaling hole
38、无连接盘孔:landless hole
39、中间孔:interstitial hole
40、无连接盘导通孔:landless via hole
41、引导孔:pilot hole
42、端接全隙孔:terminal clearomee hole
43、准表面间镀覆孔:quasi-interfacing plated-through hole
44、准尺寸孔:dimensioned hole
45、在连接盘中导通孔:via-in-pad
46、孔位:hole location
47、孔密度:hole density
48、孔图:hole pattern
49、钻孔图:drill drawing
50、装配图:assembly drawing
51、印制板组装图:printed board assembly drawing
52、参考基准:datum referance
54、基准尺寸:reference dimension
55、参考尺寸:reaerence dimension
56、直接量定尺寸:direct dimensioning
57、基准图:datum feature
58、基准边:reference edge
59、导线设计距离:design space of conductor
60、导线设计宽度:design width of conductor
61、中心距:center to center spacing
62、线宽/间距:conductor width/space
63、节距:pitch
64、精细节距:fine pitch
65、层:layer
66、层间距:layer-to-layer spacing
67、边距:edge spacing
68、外形线:trim line
69、截面积:crossection area
70、真实值表测量:truth table test
71、准确位置:true position tolerance
72、精确位置:accuracy
73、精确位置误差:cumulative tolerance
74、精确度:accuracy
75、累积误差:cumulative tolerance
76、焊垫:footprint
77、外层:external layer
78、内层:internal layer
79、接地层:ground plane
80、接地层隔离:ground plane clearance
81、电压层:voltage plane
82、电源层隔离:voltage plane clearance
83、电源层:power plane, bus plane 
84、导通网络:basic grid
85、导通网格:track grid
86、导通孔网格:via grid
87、连通盘网格:pad (land) grid
88、定位偏差:positional tolerance
89、对准靶标:bornb sight
90、梳状图形:comb pattern
91、对准标记:register mark
92、散热层:heat sink plane

六、电气互连

1、表面间连接:interlayer connection
2、层间连接:interlayer connection
3、内层连接:innerlayer connection
4、非功能表面连接:nonfunctional interfacial connection
5、跨接线:jumper wire
6、节(交)点:node
7、附加线:haywire
8、端接(点):terminal
9、连接线:terminated line
10、端接:termination
11、连接端:pad, land
12、贯穿连接:through connection
13、支线:stub
14、印制插头:tab
15、键槽:keying slot
16、连接器:connector
17、板边连接器:edge board connector
18、连接器区:connector area
19、直角板边连接器:right angle edge connector
20、偏槽口:polarizing slot
21、偏置端接区:offset terminal area
22、接地:ground
23、端接隔离(空环):terminal clearance
24、连通性:continuity
25、连接器接触:connector contact
26、接触面积:contact area
27、接触间距:contact spacing
28、接触电阻:contact resistance
29、接触尺寸:contact size
30、元件引腿(脚):component lead
31、元件插针:component pin
32、最小电气间距:minimum electrical spacing
33、导电性:conductivity 
34、边卡连接器:card-edge connector
35、插卡连接器:card-insertion connector
36、载流量:current-carrying capacity
37、蹯径:path
38、最短路径:shortest path
39、关键路径:critical path
40、倒角:miter
41、串推:daisy chain
42、斯坦纳树:steiner tree
43、最小生成树:minimum spanning tree (MST)
44、瓶颈宽度:necked width
45、短叉长度:spur length
46、短柱长度:stub length
47、曼哈顿路径:manhattan path
48、连接度(性):connectivity

七、其它

1、主面:primary side 
2、辅面:secondary side
3、支撑面:supporting plane
4、信号:signal 
5、信号导线:signal conductor
6、信号地线:signal ground
7、信号速率:signal rate
8、信号标准化:signal standardization
9、信号层:signal layer
10、寄生信号:spurious signal 
11、串扰:crosstalk
12、电容:capacitance
13、电容耦合:capacitive coupling
14、电磁干扰:electromagnetic interference
15、电磁屏蔽:electromangetic shielding
16、噪音:noise
17、电磁兼容性:electromagnetic compatbility
18、特性阻抗:impedance
19、阻抗匹配:impedance match
20、电感:inductance
21、延迟:delay 
22、微带线:microstrip
23、带状线:stripline
24、探测点:probe point
25、开窗口:cross hatching
26、跨距:span
27、共面性(度):coplanarity
28、埋入电阻:buried resistance 
29、黄金板:golden board
30、芯板:core board
31、薄基芯:thin core
32、非均衡传输线:unbalanced transmission line
33、阀值:threshold
34、极限值:threshold limit value(TLV)
35、散热层:heat sink plane
36、热隔离:heat sink plane
37、导通孔堵塞:via filiing
38、波动:surge
39、卡板:card
40、卡板盒/卡板柜:card cages/card racks
41、薄型多层板:thin type multilayer board
42、埋/盲孔多层板:
43、模块:module
44、单芯片模块:single chip module (SCM)
45、多芯片模块:multichip module (MCM)
46、多芯片模块层压基板:laminate substrate version of multichip module (MCM-L)
47、多芯片模块陶瓷基数板:ceramic substrate version o fmultichip module (MCM-C)
48、多芯片模块薄膜基板:deposition thin film substrate version of multilayer module (MCM-D)
49、嵌入凸块互连技术:buried bump interconnection technology (B2 it)
50、自动测试技术:automatic test equipment (ATE)
51、芯板导通孔堵塞:core board viafilling
52、对准标记:alignment mark
53、基准标记:fiducial mark
54、拐角标记:corner mark
55、剪切标记:crop mark
56、铣切标记:routing mark
57、对位标记:registration mark
58、缩减标记:reduvtion mark
59、层间重合度:layer to layer registration
60、狗骨结构:dog hone
61、热设计:thermal design
62、热阻:thermal resistance


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